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Precision Circuit Corporation
Electronic Assembly Services


Printed Circuit Board Assembly
Surface Mount Technology
- Single or double sided assembly
- Fully automated placement of all component sizes 0402 or greater
- Fine pitch printing and placement of 15 mil or greater
- BGA and micro BGA assembly
- Convection reflow in 7 zone top and bottom oven
Through Hole / Mixed Technology
- Semi automatic component lead forming and cutting
- Mechanical assembly, pin staking, riveting, and hardware
- Slide line capability when required
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